SPECIFICATION
ELECTROPLATING FACILITIES
- Material : Copper, Nickel, Tin-Lead, Lead free Tin, Palladium, Gold, Passivation.

HEAT TREATMENT:
- Per Requirement

PLATING PROCESSES:
- Barrel, Jigging, Reel to Reel Plating.

PLATING THICKNESS:
- Max 16µm (Plating Chemical and Process are RoSH Compliance)