ELECTROPLATING FACILITIES Material : Copper, Nickel, Tin-Lead, Lead free Tin, Palladium, Gold, Passivation. HEAT TREAMENT Per Requirement   PLATING PROCESSES Barrel, Jigging, Reel to Reel Plating.   PACKAGING SMD Carier Tapes, Bandolier, Plastic Trays, Paper Rolls or Bulk.   QUALITY DOCUMENTS SPC, PPAP, FMEA, Material certificate, Springforce Tests, Induction - and Highvoltage Tests, Cycle Tests.