Multi-layer coils

combination of small size, high inductance density, low parasitic capacitance, high Q factor

We offer the following specifications:

Plating process: see copper, nickel, tin, silver, gold

Wire sizes: from 0.20mm (AWG 32) to 1.40mm (AWG 14)

Standards: JIS, DIN, ASTM, AMS, SAE, BS, EN, NEMA, IEC

Materials:

copper with poly-urethane or poly-amide coating
copper self-bonding wire
single/double coated magnet wires

Multi-layer coils, also known as multilayer inductors or multilayer air-core inductors, offer several advantages in electronics due to their unique design and construction. Here are some of the advantages of multi-layer coils in electronics:

Small Size: Multi-layer coils are designed to be compact and space-efficient, making them ideal for miniaturized electronic devices and applications where board space is limited. Their stacked construction allows for higher inductance values to be achieved within a smaller footprint compared to traditional wire-wound or air-core inductors.
High Inductance Density: Multi-layer coils offer high inductance density, meaning they can provide relatively high inductance values in a small physical size. This allows designers to incorporate the necessary inductance into electronic circuits without taking up significant space on the PCB.
Low Parasitic Capacitance: Multi-layer coils typically have low parasitic capacitance, which minimizes the potential for unwanted coupling or interference with neighboring components in high-frequency circuits. This is advantageous in RF applications and other sensitive electronic systems where maintaining signal integrity is critical.
High Q Factor: Multi-layer coils can achieve high quality (Q) factors, indicating low energy losses and improved efficiency in electronic circuits. This results in better signal transmission and reception, reduced power consumption, and enhanced overall performance in RF and wireless communication systems.
Temperature Stability: Multi-layer coils exhibit good temperature stability, maintaining their electrical characteristics over a wide temperature range. This ensures consistent performance and reliability in electronic devices operating in varying environmental conditions.
Low DC Resistance: Multi-layer coils typically have low DC resistance (DCR), which minimizes power losses and voltage drops in electronic circuits. This is important for maximizing energy efficiency and optimizing power transfer in battery-powered devices and low-power applications.
High Frequency Operation: Multi-layer coils are capable of operating at high frequencies, making them suitable for use in RF, microwave, and high-speed digital circuits. Their low parasitic capacitance and high Q factor allow for efficient signal handling and transmission at frequencies well into the GHz range.
Ease of Assembly: Multi-layer coils are often surface-mount components, which facilitates automated assembly processes and reduces manufacturing costs. Their standardized packaging and compatibility with pick-and-place equipment streamline production and improve overall efficiency in electronics manufacturing.

Overall, multi-layer coils offer a compelling combination of small size, high inductance density, low parasitic capacitance, high Q factor, temperature stability, low DCR, and high-frequency operation, making them versatile and highly desirable components in a wide range of electronic applications, including RF circuits, wireless communication systems, portable devices, and consumer electronics.